Design for Manufacturing Quick Table of Interconnection & Packaging Material Wire Size vs. Electric Current Basics of Board, Substrate, Package, Flex Gold Plating Trace Attributes Board Layout Bond-Pad vs. Wire Die-Mount-Pad Size vs. Die Size Better Trace Layout Geometry re Trace-End Obstacle Position, Away from the 2nd Bond-point Process Assembly Process Concern Eutectic Attach and Epoxy Attach Mistakes & Advice on Board Preparation Assembly Issues and Answers Bond Variables Wire-Bond Quality Data Glob Top Encapsulation Advance Concern: Wire Inductance Principles of Wire Parasitics Inductance of 2 Wires Wire Inductance Calculation, Simplified Wire Length for Inductance Concern Wire Inductance Table & Calculation, Realistic	Tips for Better Chip Packaging Product of 1 Die in a Unit Choose the rigid substrate Plan a module layout Make the Bonding Diagram in scale Plan for other SMDs on substrate Process chip packaging first; others goes second. Product of 2~12 Dies in a Unit Design with specified cost and time criteria. Make a pre-prototype in modules. Make sure the prototype can be produced thru the multiple process & procedures. Share the design concept with us and allow us to contribute from the cost & packaging viewpoints. Allow us to join your prototype review to close the loop of "Design for Manufacturing". Set clear & realistic guidelines for the production capacity planning. Allow us to check the final release model and confirm the cost control. Remember that the open mind of true wisdom! The entire project is a matter of collaborative effort.

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