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1. Electric Current vs. Wire Size
2. Board, Substrate, Package, Flex
3. Gold Plating
4. Trace Attributes
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5. Bond-Pad vs. Wire
6. Die Mounting-Pad vs. Die
7. Trace Layout
8. Geometry re Trace-end
9. Obstacle Position
10. Assembly Process
11. Eutectic Attach vs. Epoxy Attach
12. Board Preparation
13. Assembly Issues & Answers
14. Bond Variables
15. Wire-Bond Quality
16. Glob Top Encapsulation |
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Advance Concern:
17~21 Wire Inductance / Length / Charts
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Wire-Bond Parameters
-- GraphicsA: Bond
curve, bond pattern, wave form, metal surface methods.
-- GraphicsB: Bond
force & cratering, load, power, time affects bond region
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