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Example of Job Report
   Ex1: Wedge bond, Wire 0.7mil x 2.36mil (60um) Bond-pad
 
To: AAA – Engineer, Broadcom
From: BBB -  IDAX Microelectronics
Report Date:
 
 
 1st  C/C/C  2nd  D/D/D
Subject: Assembly Report – Microwave Device
 
 
Job Scope Chip-On-Board Packaging, 5 Boards 62 wires/board x 5 boards
Wedge bond, Alum 0.7 mil
2 Critical Wires of equal length
 
1st Report: C/C/C
 
  1. Incoming Inspection
 
 
Incoming Board surface Observation:
Many short fibers around SMDs corners 		Reason:
Probably caused by the soldering operator using paper to wipe off the residual of solder flux 		Risk:
Electric short
IDAX Action:
Use tape adhesive to Get those fibers off the board		 Suggestion:
Remove fibers after wiping the flux Thoroughly with tape adhesive
 
    
Bonding Diagram
 
  2. First Unit: Not Encapsulated Yet
 
 
Preparation Tagged  each board with a number from #1~#5
Attach die while constrain epoxy within the die size       
Setup on
W/B work-stage      		Ground during Wire-Bond Operation
 
    
 
         
 
 
Side View                                               Machine View
      
Wire-Bond on Die Surface, North Part      Wire-Bond on Die surface, South Part      Wire-Bond on Die Surface, Central Part
 
  
 
 
 
2nd Report: Job is done
 
  1. Measured data
 
 
Chip, Device No: #W1(MP8M7) Thickness (Die+ Epoxy)
10.5 mil
Chip Size
57 x 77 mil
Bond-pad size
2.4mil (60um) x 2.7 mil
Space between bond-pads
0.5 mil
Critical wire length Per machine top View coordination & Calculation Top left Unit1 .04045” Unit3? 0.4052”
Lower left .04045” .04048”
  2. Unit3
       
 
 
North Side, Unit3                                            South Side, Unit3
 
 
 
 
       
 
 
West Side, Unit2                                       East Side, Unit2
 
 
 
 
 
 
Encapsulated, Optical Clear
 
 
 
 
Comments Board Wire-bond area trace-ends Very narrow & small pitch
Chip Bond-pad Size & pitch is very small
Wires in west side of die is heavily populated
Wire-bond Difficult
Hard for automation & mass production
 
  
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