IDAX builds the microelectronics assembly of prototypes and maximize
volume production units. We embrace customer goal “time to success”
and “time to market”. We solve issues in an early stage of project.

IDAX handles Chip-On- Board (COB), Multi-Chip Module (MCM), hybrid device, RF device, and MEM.

IDAX is equipped with a clean-room and state-of-the-art equipments. Our  
assembling processes are flexible. It includes epoxy die-attach, automatic wire bond, inspection, bond pull test, encapsulation, vacuum, cure, and electric open/short test etc. Our capability on process tools development differentiates us from competitors.